2

2

2

2

2_2_20 - solder paste metal content by weight

2_2_19_1 - length and width of laminate and preprep

2_2_19 - measuring hole pattern location

2_2_18_1 - thickness of laminate by cross-section

2_2_18 - thickness of laminate by mechanical measurement

2_2_17 - surface roughness and profile of metallic foil

2_2_16_1 - artwork master evaluation by overlay

2_2_16 - artwork master evaluation by use of driller panel

2_2_16 - artwork master evaluation by use of driller panel

2_2_15 cable dimension (flat)

2_2_14_1 - solder powder size - measuring microscope

2_2_14 - solder powder size - screen method

2_2_13_1 - thickness and plating in hole microhm method

2_2_12_3 - weight of copper by etchable carrier

2_2_12_1 overall thickness of copper foil

2_2_12 - thickness of copper by weight